Ronchin, Sabina
 Distribuzione geografica
Continente #
NA - Nord America 3.225
EU - Europa 532
AS - Asia 156
Continente sconosciuto - Info sul continente non disponibili 9
AF - Africa 4
OC - Oceania 3
SA - Sud America 1
Totale 3.930
Nazione #
US - Stati Uniti d'America 3.215
UA - Ucraina 132
SE - Svezia 113
CN - Cina 99
FI - Finlandia 79
IT - Italia 61
GB - Regno Unito 54
SG - Singapore 37
BG - Bulgaria 34
DE - Germania 31
NL - Olanda 13
CA - Canada 10
TR - Turchia 10
EU - Europa 9
JO - Giordania 6
RU - Federazione Russa 6
AT - Austria 3
AU - Australia 2
CZ - Repubblica Ceca 2
IN - India 2
MU - Mauritius 2
SC - Seychelles 2
BR - Brasile 1
GR - Grecia 1
JP - Giappone 1
NO - Norvegia 1
NZ - Nuova Zelanda 1
PT - Portogallo 1
RO - Romania 1
VN - Vietnam 1
Totale 3.930
Città #
Fairfield 468
Chandler 441
Ashburn 296
Jacksonville 256
Ann Arbor 237
Woodbridge 224
Seattle 195
Wilmington 156
Houston 142
Cambridge 141
Princeton 84
San Mateo 71
Beijing 67
Helsinki 44
New York 39
Sofia 34
San Diego 29
Dearborn 28
Lawrence 24
Trento 23
Los Angeles 19
Singapore 18
Washington 15
Fremont 13
Düsseldorf 10
Izmir 10
London 10
Norwalk 9
Toronto 9
Shanghai 7
Meppel 6
Nanjing 6
Costa Mesa 5
Phoenix 5
San Paolo di Civitate 5
Boardman 4
Bremen 4
Falls Church 4
Des Moines 3
Hefei 3
Jinan 3
Kunming 3
Mountain View 3
San Jose 3
Vienna 3
Andover 2
Falkenstein 2
Giessen 2
Malo 2
North Bergen 2
Olomouc 2
Shenyang 2
Acton 1
Altamura 1
Amsterdam 1
Athens 1
Atlanta 1
Baotou 1
Bonndorf 1
Brooklyn 1
Changsha 1
Chemnitz 1
Chiswick 1
Chiyoda-ku 1
Clearwater 1
Dormagen 1
Fuzhou 1
Grigno 1
Guangzhou 1
Gunzenhausen 1
Islington 1
Kilburn 1
Milan 1
Montréal 1
Moorhead 1
Munich 1
Naaldwijk 1
Napoli 1
Old Bridge 1
Oslo 1
Prescot 1
Pune 1
Rahden 1
Redmond 1
Shaoxing 1
Sorocaba 1
Timisoara 1
Trieste 1
Udine 1
Vallefoglia 1
Venice 1
Wuhan 1
Xian 1
Totale 3.234
Nome #
INFN-FBK developments of 3D sensors for High-Luminosity LHC 108
Processing and first characterization of detectors made with high resistivity n- and p-type Czochralski silicon 107
3D-FBK pixel sensors:Recent beam tests results with irradiated devices 104
Hybrid Detectors of Neutrons Based on 3D Silicon Sensors with Polysiloxane Converter 104
Preliminary results of 3D-DDTC pixel detectors for the ATLASupgrade 96
Performance Evaluation of 3D-DDTC Detectors on P-Type Substrates 96
Characterization and TCAD modelling of termination structures for silicon radiation detectors 94
Development of 3D-DDTC pixel detectors for the ATLAS upgrade 94
Beam Test Measurements With 3D-DDTC Silicon Strip Detectors on n-Type Substrate 94
Electro-optical measurements of 3D-stc detectors fabricated at ITC-IRST 93
Characterization of 3D-stc detectors fabricated at ITC-irst 92
Test Beam Measurements with 3D Silicon Strip Detectors 92
Fabrication of PIN diode detectors on thinned silicon wafers 92
Characterization of micro-strip detectors made with high resistivity n- and p-type Czochralski silicon 91
Double-Sided, Double-Type-Column 3-D Detectors: Design, Fabrication, and Technology Evaluation 90
High-performance PIN photodiodes on TMAH thinned silicon wafers 87
First electrical characterization of 3D detectors with electrodes of the same doping type 87
Test beam results of 3D silicon pixel sensors for the ATLAS upgrade 87
First experimental results on active and slim-edge silicon sensors for XFEL 87
Beam test results of thin n-in-p 3d and planar pixel sensors for the high luminosity lhc tracker upgrade at cms 87
Hybrid detectors for neutrons combining phenyl-polysiloxanes with 3D silicon detectors 85
Development of 3D detectors at FBK-irst 85
Initial results from 3D-DDTC detectors on p-type substrates 84
Fabrication and characterization of n-on-n silicon pixel detectors compatible with the Medipix2 readout chip 83
Measurements of 3D Silicon Strip Sensors by Two Manufacturers 83
Development of new 3D pixel sensors for phase 2 upgrades at LHC 83
Radiation hardness and charge collection efficiency of Lithium irradiated thin silicon diodes 82
Fabrication of 3D detectors with columnar electrodes of the same doping type 81
PFM2: A 32 × 32 processor for X-ray diffraction imaging at FELs 81
Functional characterization of a high-gain BJT radiation detector 74
A Three-Dimensional Gated Diode Structure for Surface Parameter Characterization in a 3D Sensor Technology 74
Radiation hardness of high resistivity n- and p-type magnetic Czochralski silicon 72
Pixel detector developments for tracker upgrades of the high luminosity LHC 72
High-gain phototransistors on high-resistivity silicon substrate 70
3D trenched-electrode pixel sensors: Design, technology and initial results 70
32-Channel Detection Unit for Combined XRF-XRD in Mining Transportable Applications 69
Active-edge FBK-INFN-LPNHE thin n-on-p pixel sensors for the upgrade of the ATLAS Inner Tracker 67
3D trenched-electrode sensors for charged particle tracking and timing 64
Development of 3D trenched-electrode pixel sensors with improved timing performance 64
Detection of ionizing particles with phototransistors on high resistivity thick silicon substrates 60
Characterization and modeling of signal dynamics in 3D-DDTCdetectors 58
Thin and edgeless sensors for ATLAS pixel detector upgrade 56
Functional characterization of p-on-n 3D-DDTC detectors fabricated at FBK-IRST 53
Performance of new radiation tolerant thin n-in-p Silicon pixel sensors for the CMS experiment at High Luminosity LHC 52
Guide di luce planari SiO2-TiO2:Er3+ e vetri SiO2-ErO3 prodotti per via sol gel 51
Simulation and test of novel 3D silicon radiation detectors 49
Intrinsic time resolution of 3D-trench silicon pixels for charged particle detection 44
Performance of new radiation-tolerant thin planar and 3D columnar n+ on p silicon pixel sensors up to a maximum fluence of ∼5×1015neq/cm2 44
Small pitch 3D devices 42
Performance of the FBK/INFN/LPNHE thin active edge pixel detectors for the upgrade of the ATLAS Inner Tracker 35
Advances in 3D Sensor Technology by Using Stepper Lithography 35
Radiation resistant innovative 3D pixel sensors for the CMS upgrade at the High Luminosity LHC 33
Study of the signal formation in 3D single-type-column silicon detectors 32
Novel 3D Pixel Sensors for the Upgrade of the ATLAS Inner Tracker 29
Quality Control (QC) of FBK preproduction 3D Si sensors for ATLAS HL-LHC Upgrades 21
32-Channel silicon strip detection module for combined X-ray fluorescence spectroscopy and X-ray diffractometry analysis 14
Totale 4.033
Categoria #
all - tutte 17.466
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 193
Totale 17.659


Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2018/2019130 0 0 0 0 0 0 0 0 0 0 0 130
2019/20201.147 65 35 83 99 105 140 197 116 115 70 56 66
2020/2021606 66 89 12 82 48 39 59 41 51 40 56 23
2021/2022534 7 48 2 51 9 24 24 106 32 52 76 103
2022/2023832 129 97 13 127 66 127 0 67 107 7 37 55
2023/2024313 26 18 29 16 39 104 12 16 1 23 7 22
Totale 4.033