The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for new high radiation-tolerant solid-state pixel sensors, capable of surviving irradiation fluences up to a few 1016neq/cm2 at ∼3cm from the interaction point. The INFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler, is aiming at the development of thin n+ on p type pixel sensors to be operated at the HL-LHC. The R&D covers both planar and 3D pixel devices made on substrates obtained by the Direct Wafer Bonding technique. The active thickness of the planar sensors studied in this paper is 100μm or 130μm, that of 3D sensors 130μm. First prototypes of hybrid modules, bump-bonded to the present CMS readout chips (PSI46 digital), have been characterized in beam tests. First results on their performance before and after irradiation up to a maximum fluence of ∼5×1015neq/cm2 are reported in this article.

Performance of new radiation-tolerant thin planar and 3D columnar n+ on p silicon pixel sensors up to a maximum fluence of ∼5×1015neq/cm2 / Boscardin, M.; Ceccarelli, R.; Dalla Betta, G. F.; Darbo, G.; Dinardo, M. E.; Giacomini, G.; Menasce, D.; Mendicino, R.; Meschini, M.; Messineo, A.; Moroni, L.; Rivera, R.; Ronchin, S.; Sultan, D. M. S.; Uplegger, L.; Viliani, L.; Zoi, I.; Zuolo, D.. - In: NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH. SECTION A, ACCELERATORS, SPECTROMETERS, DETECTORS AND ASSOCIATED EQUIPMENT. - ISSN 0168-9002. - STAMPA. - 953:(2020), pp. 163222.1-163222.8. [10.1016/j.nima.2019.163222]

Performance of new radiation-tolerant thin planar and 3D columnar n+ on p silicon pixel sensors up to a maximum fluence of ∼5×1015neq/cm2

Boscardin M.;Dalla Betta G. F.;Mendicino R.;Ronchin S.;Sultan D. M. S.;
2020

Abstract

The High Luminosity upgrade of the CERN Large Hadron Collider (HL-LHC) calls for new high radiation-tolerant solid-state pixel sensors, capable of surviving irradiation fluences up to a few 1016neq/cm2 at ∼3cm from the interaction point. The INFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler, is aiming at the development of thin n+ on p type pixel sensors to be operated at the HL-LHC. The R&D covers both planar and 3D pixel devices made on substrates obtained by the Direct Wafer Bonding technique. The active thickness of the planar sensors studied in this paper is 100μm or 130μm, that of 3D sensors 130μm. First prototypes of hybrid modules, bump-bonded to the present CMS readout chips (PSI46 digital), have been characterized in beam tests. First results on their performance before and after irradiation up to a maximum fluence of ∼5×1015neq/cm2 are reported in this article.
Boscardin, M.; Ceccarelli, R.; Dalla Betta, G. F.; Darbo, G.; Dinardo, M. E.; Giacomini, G.; Menasce, D.; Mendicino, R.; Meschini, M.; Messineo, A.; Moroni, L.; Rivera, R.; Ronchin, S.; Sultan, D. M. S.; Uplegger, L.; Viliani, L.; Zoi, I.; Zuolo, D.
Performance of new radiation-tolerant thin planar and 3D columnar n+ on p silicon pixel sensors up to a maximum fluence of ∼5×1015neq/cm2 / Boscardin, M.; Ceccarelli, R.; Dalla Betta, G. F.; Darbo, G.; Dinardo, M. E.; Giacomini, G.; Menasce, D.; Mendicino, R.; Meschini, M.; Messineo, A.; Moroni, L.; Rivera, R.; Ronchin, S.; Sultan, D. M. S.; Uplegger, L.; Viliani, L.; Zoi, I.; Zuolo, D.. - In: NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH. SECTION A, ACCELERATORS, SPECTROMETERS, DETECTORS AND ASSOCIATED EQUIPMENT. - ISSN 0168-9002. - STAMPA. - 953:(2020), pp. 163222.1-163222.8. [10.1016/j.nima.2019.163222]
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/11572/293893
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