IRIS
Sultan, D M S
 Distribuzione geografica
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Continente #
NA - Nord America 971
EU - Europa 166
AS - Asia 78
Continente sconosciuto - Info sul continente non disponibili 2
AF - Africa 1
Totale 1.218
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Nazione #
US - Stati Uniti d'America 971
IT - Italia 74
CN - Cina 43
FI - Finlandia 27
SE - Svezia 26
SG - Singapore 26
GB - Regno Unito 14
BG - Bulgaria 7
DE - Germania 6
UA - Ucraina 6
JO - Giordania 3
TR - Turchia 3
AT - Austria 2
CZ - Repubblica Ceca 2
A2 - ???statistics.table.value.countryCode.A2??? 1
EU - Europa 1
FR - Francia 1
HK - Hong Kong 1
JP - Giappone 1
LK - Sri Lanka 1
MU - Mauritius 1
RO - Romania 1
Totale 1.218
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Città #
Fairfield 136
Chandler 134
Ann Arbor 112
Ashburn 106
Cambridge 62
Woodbridge 60
Seattle 52
Wilmington 51
Houston 38
Princeton 34
Trento 28
Beijing 24
Helsinki 19
Jacksonville 17
Fremont 16
San Mateo 16
Dearborn 13
New York 13
San Diego 9
Singapore 9
Sofia 7
London 5
Washington 5
Boardman 4
Cagliari 4
Dallas 4
Izmir 3
Nanjing 3
San Paolo di Civitate 3
Shanghai 3
Venice 3
Altamura 2
Bergamo 2
Clearwater 2
Costa Mesa 2
Düsseldorf 2
Jinan 2
Kunming 2
Laives 2
Norwalk 2
Olomouc 2
Prescot 2
Vienna 2
Atlanta 1
Baotou 1
Bonndorf 1
Clifton 1
Colombo 1
Cupertino 1
Desenzano del Garda 1
Falkenstein 1
Harbin 1
Hefei 1
Kharkov 1
Lana 1
Lappeenranta 1
Mountain View 1
North Bergen 1
Pine Grove 1
Quzhou 1
San Jose 1
Shaoxing 1
Stockholm 1
Timisoara 1
Torviscosa 1
Trieste 1
Udine 1
Xian 1
Totale 1.042
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Nome #
INFN-FBK developments of 3D sensors for High-Luminosity LHC 109
Characterization of the first double-sided 3D radiation sensors fabricated at FBK on 6-inch silicon wafers 102
Development of a new generation of 3D pixel sensors for HL-LHC 94
Micromachined Silicon Radiation Sensors – Part 2: Fabrication Technologies 93
First production of new thin 3D sensors for HL-LHC at FBK 90
Beam test results of thin n-in-p 3d and planar pixel sensors for the high luminosity lhc tracker upgrade at cms 90
Investigation of leakage current and breakdown voltage in irradiated double-sided 3D silicon sensors 88
Development of new 3D pixel sensors for phase 2 upgrades at LHC 84
Micromachined Silicon Radiation Sensors – Part 1: Design And Experimental Characterization 79
A Three-Dimensional Gated Diode Structure for Surface Parameter Characterization in a 3D Sensor Technology 74
Pixel detector developments for tracker upgrades of the high luminosity LHC 72
The INFN-FBK "phase-2" R&D program 70
Performance of new radiation-tolerant thin planar and 3D columnar n+ on p silicon pixel sensors up to a maximum fluence of ∼5×1015neq/cm2 44
Small pitch 3D devices 43
Constraints on Higgs boson production with large transverse momentum using H →b b ¯ decays in the ATLAS detector 36
Electrical characterization of FBK small-pitch 3D sensors after γ-ray, neutron and proton irradiations 35
Quality Control (QC) of FBK preproduction 3D Si sensors for ATLAS HL-LHC Upgrades 21
Development of Small-Pitch, Thin 3D Sensors for Pixel Detector Upgrades at HL-LHC 19
Cold temperature characterization of ring triplets based on RD53A readout chip 16
TCAD Analysis of Leakage Current and Breakdown Voltage in Small Pitch 3D Pixel Sensors 10
Test of ITk 3D sensor pre-production modules with ITkPixV1.1 chip 7
Totale 1.276
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Categoria #
all - tutte 7.263
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 7.263
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/2020357 0 0 17 41 28 66 81 41 34 24 17 8
2020/2021116 21 14 10 9 16 10 1 13 2 12 2 6
2021/2022155 3 10 5 8 2 6 15 26 7 19 28 26
2022/2023238 23 36 0 36 19 41 0 20 18 1 22 22
2023/2024158 8 19 17 4 21 35 14 12 9 0 7 12
2024/202511 7 4 0 0 0 0 0 0 0 0 0 0
Totale 1.276