IRIS
Sultan, D M S
 Distribuzione geografica
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Continente #
NA - Nord America 964
EU - Europa 158
AS - Asia 63
Continente sconosciuto - Info sul continente non disponibili 2
AF - Africa 1
Totale 1.188
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Nazione #
US - Stati Uniti d'America 964
IT - Italia 71
CN - Cina 43
FI - Finlandia 26
SE - Svezia 24
GB - Regno Unito 14
SG - Singapore 11
BG - Bulgaria 7
DE - Germania 6
UA - Ucraina 6
JO - Giordania 3
TR - Turchia 3
AT - Austria 2
A2 - ???statistics.table.value.countryCode.A2??? 1
EU - Europa 1
FR - Francia 1
HK - Hong Kong 1
JP - Giappone 1
LK - Sri Lanka 1
MU - Mauritius 1
RO - Romania 1
Totale 1.188
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Città #
Fairfield 136
Chandler 134
Ann Arbor 112
Ashburn 106
Cambridge 62
Woodbridge 60
Seattle 52
Wilmington 51
Houston 38
Princeton 34
Trento 28
Beijing 24
Helsinki 19
Jacksonville 17
Fremont 16
San Mateo 16
Dearborn 13
New York 13
San Diego 9
Sofia 7
London 5
Washington 5
Cagliari 4
Boardman 3
Izmir 3
Nanjing 3
San Paolo di Civitate 3
Shanghai 3
Venice 3
Altamura 2
Bergamo 2
Clearwater 2
Costa Mesa 2
Düsseldorf 2
Jinan 2
Kunming 2
Norwalk 2
Prescot 2
Vienna 2
Atlanta 1
Baotou 1
Bonndorf 1
Colombo 1
Cupertino 1
Desenzano del Garda 1
Falkenstein 1
Harbin 1
Hefei 1
Kharkov 1
Mountain View 1
North Bergen 1
Pine Grove 1
Quzhou 1
San Jose 1
Shaoxing 1
Timisoara 1
Torviscosa 1
Trieste 1
Udine 1
Xian 1
Totale 1.020
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Nome #
INFN-FBK developments of 3D sensors for High-Luminosity LHC 107
Characterization of the first double-sided 3D radiation sensors fabricated at FBK on 6-inch silicon wafers 102
Micromachined Silicon Radiation Sensors – Part 2: Fabrication Technologies 93
Development of a new generation of 3D pixel sensors for HL-LHC 93
First production of new thin 3D sensors for HL-LHC at FBK 88
Investigation of leakage current and breakdown voltage in irradiated double-sided 3D silicon sensors 88
Beam test results of thin n-in-p 3d and planar pixel sensors for the high luminosity lhc tracker upgrade at cms 87
Development of new 3D pixel sensors for phase 2 upgrades at LHC 83
Micromachined Silicon Radiation Sensors – Part 1: Design And Experimental Characterization 79
A Three-Dimensional Gated Diode Structure for Surface Parameter Characterization in a 3D Sensor Technology 74
Pixel detector developments for tracker upgrades of the high luminosity LHC 71
The INFN-FBK "phase-2" R&D program 69
Performance of new radiation-tolerant thin planar and 3D columnar n+ on p silicon pixel sensors up to a maximum fluence of ∼5×1015neq/cm2 44
Small pitch 3D devices 40
Electrical characterization of FBK small-pitch 3D sensors after γ-ray, neutron and proton irradiations 33
Constraints on Higgs boson production with large transverse momentum using H →b b ¯ decays in the ATLAS detector 28
Quality Control (QC) of FBK preproduction 3D Si sensors for ATLAS HL-LHC Upgrades 21
Development of Small-Pitch, Thin 3D Sensors for Pixel Detector Upgrades at HL-LHC 17
Cold temperature characterization of ring triplets based on RD53A readout chip 14
TCAD Analysis of Leakage Current and Breakdown Voltage in Small Pitch 3D Pixel Sensors 8
Test of ITk 3D sensor pre-production modules with ITkPixV1.1 chip 7
Totale 1.246
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Categoria #
all - tutte 6.420
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 6.420
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2018/2019102 0 0 0 0 0 0 0 0 0 0 59 43
2019/2020390 20 13 17 41 28 66 81 41 34 24 17 8
2020/2021116 21 14 10 9 16 10 1 13 2 12 2 6
2021/2022155 3 10 5 8 2 6 15 26 7 19 28 26
2022/2023238 23 36 0 36 19 41 0 20 18 1 22 22
2023/2024139 8 19 17 4 21 35 14 12 9 0 0 0
Totale 1.246