ITk detector, the new ATLAS tracking system at High Luminosity LHC, will be equipped with 3D pixel sensor modules in the innermost layer (L0). The pixel cell dimensions will be either 25 x 100 mu m(2 )(barrel) or 50 x 50 mu m(2) (endcap), with one read-out electrode at the centre of a pixel and four bias electrodes at the corners. Sensors from pre-production wafers (50 x 50 mu m(2)) produced by FBK have been bump bonded to ITkPixV1.1 chips at IZM. Bare modules have been assembled in Genoa on Single Chip Cards and characterized in laboratory and on beam.
Test of ITk 3D sensor pre-production modules with ITkPixV1.1 chip / Calderini, G; Crescioli, F; Dalla Betta, Gf; Gariano, G; Gemme, C; Guescini, F; Hadzic, S; Heim, T; Lapertosa, A; Ravera, S; Rummler, A; Samy, Maa; Sultan, Dms; Vannoli, L; Ye, H. - In: JOURNAL OF INSTRUMENTATION. - ISSN 1748-0221. - ELETTRONICO. - 18:1(2023), p. C01010. [10.1088/1748-0221/18/01/C01010]
Test of ITk 3D sensor pre-production modules with ITkPixV1.1 chip
Dalla Betta, GF;Samy, MAA;Sultan, DMS;
2023-01-01
Abstract
ITk detector, the new ATLAS tracking system at High Luminosity LHC, will be equipped with 3D pixel sensor modules in the innermost layer (L0). The pixel cell dimensions will be either 25 x 100 mu m(2 )(barrel) or 50 x 50 mu m(2) (endcap), with one read-out electrode at the centre of a pixel and four bias electrodes at the corners. Sensors from pre-production wafers (50 x 50 mu m(2)) produced by FBK have been bump bonded to ITkPixV1.1 chips at IZM. Bare modules have been assembled in Genoa on Single Chip Cards and characterized in laboratory and on beam.| File | Dimensione | Formato | |
|---|---|---|---|
|
JINST_2023_1.pdf
Solo gestori archivio
Tipologia:
Versione editoriale (Publisher’s layout)
Licenza:
Tutti i diritti riservati (All rights reserved)
Dimensione
1.7 MB
Formato
Adobe PDF
|
1.7 MB | Adobe PDF | Visualizza/Apri |
I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione
