Development of Small-Pitch, Thin 3D Sensors for Pixel Detector Upgrades at HL-LHC

3D Si radiation sensors came along with extreme radiation hard properties, primarily owing to the geometrical advantages over planar sensors where electrodes are formed penetrating through the active substrate volume. Among them: reduction of the inter-electrode distance, lower depletion voltage requirement, inter-columnar high electric field distribution, lower trapping probability, faster charge collection capability, lower power dissipation, and lower inter-pitch charge sharing. Since several years, FBK has developed 3D sensors with a double-sided technology, that have also been installed in the ATLAS Insertable B-Layer at LHC. However, the future High-Luminosity LHC (HL-LHC) upgrades, aimed to be operational by 2024, impose a complete swap of current 3D detectors with more radiation hard sensor design, able to withstand very large particle fluences up to 2×1016 cm-2 1-MeV equivalent neutrons. The extreme luminosity conditions and related issues in occupancy and radiation hardness lead to very dense pixel granularity (50×50 or 25×100 µm2), thinner active region (~100 µm), narrower columnar electrodes (~5µm diameter) with reduced inter-electrode spacing (~30 µm), and very slim edges (~100 µm) into the 3D pixel sensor design. This thesis includes the development of this new generation of small-pitch and thin 3D radiation sensors aimed at the foreseen Inner Tracker (ITk) upgrades at HL-LHC.