Position-resolved timing characterisation tests were performed on individual pixels of hexagonal and trench 3D silicon sensors. An IR laser was used to deposit energy equivalent to 1 MIP with a 1 μm spatial resolution onto each sensor, which were attached to custom-designed fast read-out electronics chips. Time of Arrival (ToA) values obtained were (544 ± 29.8) ps for the hexagonal geometry, and (515 ± 8.2) ps for the trench geometry.
Position-resolved timing characterisation tests of hexagonal and trench 3D silicon detectors / Addison, M.; Da Via, C.; Lai, A.; Dalla Betta, G. -F.; Garau, M.; Lampis, A.; Aresti, M.; Cardini, A.; Cossu, G. -M.; Loi, A.. - In: NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH. SECTION A, ACCELERATORS, SPECTROMETERS, DETECTORS AND ASSOCIATED EQUIPMENT. - ISSN 0168-9002. - STAMPA. - 1054:(2023), p. 168392. [10.1016/j.nima.2023.168392]
Position-resolved timing characterisation tests of hexagonal and trench 3D silicon detectors
Dalla Betta G. -F.;
2023-01-01
Abstract
Position-resolved timing characterisation tests were performed on individual pixels of hexagonal and trench 3D silicon sensors. An IR laser was used to deposit energy equivalent to 1 MIP with a 1 μm spatial resolution onto each sensor, which were attached to custom-designed fast read-out electronics chips. Time of Arrival (ToA) values obtained were (544 ± 29.8) ps for the hexagonal geometry, and (515 ± 8.2) ps for the trench geometry.| File | Dimensione | Formato | |
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