Development and thermo-mechanical behaviour of nanocomposite epoxy adhesives

Two kinds of organo-modified (OM) clays were dispersed in an epoxy resin for the preparation of nanocomposite adhesives at various filler amounts. XRD tests evidenced the formation of intercalated structures, increasing the intercalation degree with the clay hydrophilicity. The original transparency of the samples was retained up to a filler content of 3 wt%, and then decreased due to filler agglomeration. The glass transition temperature of nanocomposites filled with the more hydrophilic clay (30B) raised up to a filler content of 3 wt% and then decreased, probably because of the concurrent and contrasting effects of the physical chain blocking and reduction of the cross-linking degree. Also elastic modulus, stress at break, and fracture toughness were sensibly improved by nanoclay addition up to filler loadings of 0.5–1 wt%. For higher concentrations the positive contribution of clay nanoplatelets was counterbalanced by the presence of gglomerated tactoids in the matrix. Mechanical tests on single-lap composite (epoxy/glass) bonded joints evidenced an enhancement of the shear strength by about 25% for an optimal filler content of 1 wt%. Therefore, it was concluded that the addition of a proper amount of OM clay to epoxy adhesives could represent an effective way to improve the shear resistance of adhesively bonded composite structures. Copyright © 2011 John Wiley & Sons, Ltd.