X-ray diffraction is frequently employed for the analysis of mechanical stresses in polycrystalline specimens. To this end, suitable so-called diffraction elastic constants are needed for determining the components of the mechanical stress tensor from measured lattice strains. These diffraction elastic constants depend on the single-crystal elastic constants of the material considered and the so-called grain interaction, describing the distribution of stresses and strains over the crystallographically differently oriented crystallites composing the specimen. Well-known grain interaction models, as due to Voigt, to Reuss, to Neerfeld and Hill and to Eshelby and Kro¨ ner, may be applied to bulk specimens, but they are generally not suitable for thin films. In this paper, an average ‘effective’ grain interaction model is proposed that consists of a linear combination of basic extreme models including new models specially suited to thin films. Experimental verification has been achieved by X-ray diffraction strain measurements performed on a sputter-deposited copper film. This is the first time that anisotropic grain interaction has been analysed quantitatively.

The determination of stresses in thin films: modelling elastic grain interaction

Leoni, Matteo;
2003

Abstract

X-ray diffraction is frequently employed for the analysis of mechanical stresses in polycrystalline specimens. To this end, suitable so-called diffraction elastic constants are needed for determining the components of the mechanical stress tensor from measured lattice strains. These diffraction elastic constants depend on the single-crystal elastic constants of the material considered and the so-called grain interaction, describing the distribution of stresses and strains over the crystallographically differently oriented crystallites composing the specimen. Well-known grain interaction models, as due to Voigt, to Reuss, to Neerfeld and Hill and to Eshelby and Kro¨ ner, may be applied to bulk specimens, but they are generally not suitable for thin films. In this paper, an average ‘effective’ grain interaction model is proposed that consists of a linear combination of basic extreme models including new models specially suited to thin films. Experimental verification has been achieved by X-ray diffraction strain measurements performed on a sputter-deposited copper film. This is the first time that anisotropic grain interaction has been analysed quantitatively.
5
U., Welzel; P., Lamparter; Leoni, Matteo; E. J., Mittemeijer
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/11572/72919
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