The determination of stresses in thin films: modelling elastic grain interaction

X-ray diffraction is frequently employed for the analysis of mechanical stresses in polycrystalline specimens. To this end, suitable so-called diffraction elastic constants are needed for determining the components of the mechanical stress tensor from measured lattice strains. These diffraction elastic constants depend on the single-crystal elastic constants of the material considered and the so-called grain interaction, describing the distribution of stresses and strains over the crystallographically differently oriented crystallites composing the specimen. Well-known grain interaction models, as due to Voigt, to Reuss, to Neerfeld and Hill and to Eshelby and Kro¨ ner, may be applied to bulk specimens, but they are generally not suitable for thin films. In this paper, an average ‘effective’ grain interaction model is proposed that consists of a linear combination of basic extreme models including new models specially suited to thin films. Experimental verification has been achieved by X-ray diffraction strain measurements performed on a sputter-deposited copper film. This is the first time that anisotropic grain interaction has been analysed quantitatively.