Tracking particles at extreme fluences requires the accurate measurement of the charged particle timing at the pixel level in order to cope with the increased occupancy of HL-LHC experiments. Maintaining this precision throughout the operational life of the detector is crucial. This work demonstrates that the 55×55μm2 wide 150μm thick 3D trench-type pixels, developed by the TimeSPOT Collaboration, maintain the performance of non-irradiated sensors even after exposure to fluences as high as 1⋅10171MeVneqcm−2. The preliminary results of a beam test characterization using minimum ionizing particles at the SPS North area beam facility reveal that the charge collection and the time resolution of the irradiated sensors are comparable to those of non-irradiated ones, by increasing the operational bias voltage. A minor reduction in detection efficiency, approximately 4%, is observed post-irradiation. Currently, 3D trench-type pixels are among the fastest pixel detectors available for tracking ...

Tracking particles at extreme fluences requires the accurate measurement of the charged particle timing at the pixel level in order to cope with the increased occupancy of HL-LHC experiments. Maintaining this precision throughout the operational life of the detector is crucial. This work demonstrates that the 55 × 55 μm2 wide 150 μm thick 3D trench-type pixels, developed by the TimeSPOT Collaboration, maintain the performance of non-irradiated sensors even after exposure to fluences as high as 1⋅10^17 1MeV neq cm^−2. The preliminary results of a beam test characterization using minimum ionizing particles at the SPS North area beam facility reveal that the charge collection and the time resolution of the irradiated sensors are comparable to those of non-irradiated ones, by increasing the operational bias voltage. A minor reduction in detection efficiency, approximately 4%, is observed post-irradiation. Currently, 3D trench-type pixels are among the fastest pixel detectors available for tracking harged particles and hold significant promise for future tracking system upgrades. This preliminary evaluation suggests their suitability for use in even harsher radiation environments than High Luminosity Large Hadron Collider (HL-LHC) such as future experiments at the Future Circular Hadron Collider (FCC-hh).

Performance of 3D trench silicon pixel sensors irradiated up to 1x10^17 1 MeV neq cm^-2 / Lampis, A.; Addison, M.; Bellora, A.; Boscardin, M.; Brundu, D.; Cardini, A.; Cossu, G. M.; Dalla Betta, G. F.; La Delfa, L.; Lai, A.; Loi, A.; Obertino, M.; Ronchin, S.; Vecchi, S.; Verdoglia, M.. - In: NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH. SECTION A, ACCELERATORS, SPECTROMETERS, DETECTORS AND ASSOCIATED EQUIPMENT. - ISSN 0168-9002. - STAMPA. - 1069:(2024), p. 169984. [10.1016/j.nima.2024.169984]

Performance of 3D trench silicon pixel sensors irradiated up to 1x10^17 1 MeV neq cm^-2

Boscardin, M.;Dalla Betta, G. F.;Ronchin, S.;
2024-01-01

Abstract

Tracking particles at extreme fluences requires the accurate measurement of the charged particle timing at the pixel level in order to cope with the increased occupancy of HL-LHC experiments. Maintaining this precision throughout the operational life of the detector is crucial. This work demonstrates that the 55×55μm2 wide 150μm thick 3D trench-type pixels, developed by the TimeSPOT Collaboration, maintain the performance of non-irradiated sensors even after exposure to fluences as high as 1⋅10171MeVneqcm−2. The preliminary results of a beam test characterization using minimum ionizing particles at the SPS North area beam facility reveal that the charge collection and the time resolution of the irradiated sensors are comparable to those of non-irradiated ones, by increasing the operational bias voltage. A minor reduction in detection efficiency, approximately 4%, is observed post-irradiation. Currently, 3D trench-type pixels are among the fastest pixel detectors available for tracking ...
2024
Lampis, A.; Addison, M.; Bellora, A.; Boscardin, M.; Brundu, D.; Cardini, A.; Cossu, G. M.; Dalla Betta, G. F.; La Delfa, L.; Lai, A.; Loi, A.; Oberti...espandi
Performance of 3D trench silicon pixel sensors irradiated up to 1x10^17 1 MeV neq cm^-2 / Lampis, A.; Addison, M.; Bellora, A.; Boscardin, M.; Brundu, D.; Cardini, A.; Cossu, G. M.; Dalla Betta, G. F.; La Delfa, L.; Lai, A.; Loi, A.; Obertino, M.; Ronchin, S.; Vecchi, S.; Verdoglia, M.. - In: NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH. SECTION A, ACCELERATORS, SPECTROMETERS, DETECTORS AND ASSOCIATED EQUIPMENT. - ISSN 0168-9002. - STAMPA. - 1069:(2024), p. 169984. [10.1016/j.nima.2024.169984]
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11572/438953
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