Nanofabrication of high aspect ratio (∼50:1) sub-10 nm silicon nanowires using inductively coupled plasma etching

The development of nanofabrication techniques for creating high aspect ratio (∼50:1) sub-10 nm silicon nanowires (SiNWs) with smooth, uniform, and straight vertical sidewalls using an inductively coupled plasma (ICP) etching process at 20 °C is reported. In particular, to improve the quality and flexibility of the pattern transfer process for high aspect ratio SiNWs, hydrogen silsesquioxane, a high-resolution, inorganic, negative-tone resist for electron-beam lithography has been used as both the resist for defining sub-10 nm patterns and the hard mask for etching the underneath silicon material. The effects of SF6/C4F8 gas flow rates, chamber pressure, platen power and ICP power on the etch rate, selectivity, and sidewall profile are investigated. To minimize plasma-induced sidewall damage, moderate plasma excitation power (ICP power of 600 W) and low ion energy (platen power of 6-12 W) were used. Using the optimized etch process at room temperature (20 °C), the authors have successfu...