This doctorate thesis focuses on the application of micromachining fabrication technologies for the realization of Radio Frequency (RF) bandpass filters. The work has been inspired and supported by the European Space Agency (ESA) Contract No. 22706/09/NL/GLC of the ARTES 5 Workplan 2008 “Micro-machined Filters in Multi-layer Technology for Satellite On-board Communication Systems†(MIGNON Project). The main purpose of the project is the design and realization of high performance bandpass filters in the Ka and L/S band for on board applications. The use of modern micromachining technologies should allow for space and weight reduction as well as for a cost effective realization of these devices. In addition the tight tolerances obtained with micromachining techniques facilitate an industrial fabrication of filters with high yield. The thesis proposes novel concepts to accomplish this task and provides also the fabrication processes suitable to realize the devices. In addition this work gives also a deeper insight into critical fabrication steps like wafer to wafer thermocompression bonding using gold (Au) and silver (Ag) as an intermediate layer and fabrication of Through Silicon Vias (TSV).

Multilayer Micromachined RF MEMS Filters at Ka and L/S Band For On-Board Satellite Communication Systems / Qureshi, Abdul Qader Ahsan. - (2013), pp. 1-260.

Multilayer Micromachined RF MEMS Filters at Ka and L/S Band For On-Board Satellite Communication Systems

Qureshi, Abdul Qader Ahsan
2013-01-01

Abstract

This doctorate thesis focuses on the application of micromachining fabrication technologies for the realization of Radio Frequency (RF) bandpass filters. The work has been inspired and supported by the European Space Agency (ESA) Contract No. 22706/09/NL/GLC of the ARTES 5 Workplan 2008 “Micro-machined Filters in Multi-layer Technology for Satellite On-board Communication Systems†(MIGNON Project). The main purpose of the project is the design and realization of high performance bandpass filters in the Ka and L/S band for on board applications. The use of modern micromachining technologies should allow for space and weight reduction as well as for a cost effective realization of these devices. In addition the tight tolerances obtained with micromachining techniques facilitate an industrial fabrication of filters with high yield. The thesis proposes novel concepts to accomplish this task and provides also the fabrication processes suitable to realize the devices. In addition this work gives also a deeper insight into critical fabrication steps like wafer to wafer thermocompression bonding using gold (Au) and silver (Ag) as an intermediate layer and fabrication of Through Silicon Vias (TSV).
2013
XXV
2012-2013
Ingegneria e scienza dell'Informaz (29/10/12-)
Information and Communication Technology
Margesin, Benno
no
Inglese
Settore ING-IND/31 - Elettrotecnica
Settore ING-INF/02 - Campi Elettromagnetici
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11572/368469
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