Understanding the local fracture resistance of microstructural features, such as brittle inclusions, coatings, and interfaces, at the microscale is critical for microstructure-informed design of materials. In this study, a novel approach has been formulated to decompose the J-integral evaluation of the elastic energy release rate to the three-dimensional stress intensity factors directly from experimental measurements of the elastic deformation gradient tensors of the crack field by in situ high (angular) resolution electron backscatter diffraction (HR-EBSD). An exemplar study is presented of a quasi-static crack, inclined to the observed surface, propagating on low index {hkl} planes in a (001) single crystal silicon wafer.
HR-EBSD Analysis of in Situ Stable Crack Growth at the Micron Scale / Koko, Abdalrhaman; Becker, Thorsten H.; Elmukashfi, Elsiddig; Pugno, Nicola M.; Wilkinson, Angus J.; James Marrow, T.. - In: JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS. - ISSN 0022-5096. - 2023, 172:(2023), pp. 1-31. [10.1016/j.jmps.2022.105173]
HR-EBSD Analysis of in Situ Stable Crack Growth at the Micron Scale
Nicola M. Pugno;
2023-01-01
Abstract
Understanding the local fracture resistance of microstructural features, such as brittle inclusions, coatings, and interfaces, at the microscale is critical for microstructure-informed design of materials. In this study, a novel approach has been formulated to decompose the J-integral evaluation of the elastic energy release rate to the three-dimensional stress intensity factors directly from experimental measurements of the elastic deformation gradient tensors of the crack field by in situ high (angular) resolution electron backscatter diffraction (HR-EBSD). An exemplar study is presented of a quasi-static crack, inclined to the observed surface, propagating on low index {hkl} planes in a (001) single crystal silicon wafer.File | Dimensione | Formato | |
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