Role of Anodic Time in Pulse-Reverse Electrocodeposition of Nano-SiC Particles

This work focuses on the significance of the particle's residence time in composite electrodeposition. Ni-SiC were produced using different pulse-reverse (PR) waveforms based on the average particle diameter (60 nm). The waveform was designed to deposit a metal thickness equivalent to the average diameter during the cathodic pulse and strip half during the anodic pulse. The shape of the waveform was modified to study its effect on particle codeposition by changing the cathodic and anodic pulse current density peaks and cycle time while maintaining the same charge. For benchmark, samples were also produced under direct current (DC), matching the cathodic pulse current density peaks and average. The electrodeposition was done in an additive-free and SDS-Watts bath. ζ-potential measurements were employed to determine the interaction between particles and electrolyte. A relation was established between particle incorporation rate and residence time at the electrode interface, examining. The microhardness of the deposits was also studied. The SiC content was more than doubled by PR compared to DC, from 2 vol.% to 5.5 vol.% even after SDS addition. The increase in codeposition rate was related to the anodic pulse time, supported by the existing models on the mechanisms of particle codeposition.