On-chip direct coupling of dielectric waveguides to Si substrate-integrated photodetectors has been realized within a top-down approach. A first-run 44% external quantum efficiency at 850 nm is shown for an oxynitride photonic integrated circuit at room temperature.
Top-down convergence of near-infrared photonics with silicon substrate-integrated electronics / Bernard, Martino; Acerbi, Fabio; Paternoster, Giovanni; Piccoli, Gioele; Gemma, Luca; Brunelli, Davide; Gola, Alberto; Pucker, Georg; Pancheri, Lucio; Ghulinyan, Mher. - In: OPTICA. - ISSN 2334-2536. - ELETTRONICO. - 8:11(2021), pp. 1363-1364. [10.1364/OPTICA.441496]
Top-down convergence of near-infrared photonics with silicon substrate-integrated electronics
Bernard, Martino;Acerbi, Fabio;Piccoli, Gioele;Gemma, Luca;Brunelli, Davide;Pancheri, Lucio;Ghulinyan, Mher
2021-01-01
Abstract
On-chip direct coupling of dielectric waveguides to Si substrate-integrated photodetectors has been realized within a top-down approach. A first-run 44% external quantum efficiency at 850 nm is shown for an oxynitride photonic integrated circuit at room temperature.File in questo prodotto:
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