A thermally-insulated Ultra-fast High temperature Sintering (UHS) has been developed to maximize the densification of 3 mol% yttria-stabilized zirconia and improve the energy efficiency of the process. Thermally-Insulated UHS (TI-UHS) employed a fibreboard insulator, which reduced the energy consumption by ≈40% compared to the reference set-up. An ultrafast heating rate, approaching ≈2000°C/min, produced dense (99% relative density) and fine-grained (178±18 nm) microstructures within 60 s. By cross-linking finite element simulations with master sintering curves a good fit between experimental and predicted density was obtained, allowing the development of predictive models for UHS densification. © 2021 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Thermally-insulated ultra-fast high temperature sintering (UHS) of zirconia: A master sintering curve analysis / Dong, Jian; Pouchly, Vaclav; Biesuz, Mattia; Tyrpekl, Václav; Vilémová, Monika; Kermani, Milad; Reece, Mike; Hu, Chunfeng; Grasso, Salvatore. - In: SCRIPTA MATERIALIA. - ISSN 1359-6462. - 203:(2021), pp. 114076.1-114076.6. [10.1016/j.scriptamat.2021.114076]
Thermally-insulated ultra-fast high temperature sintering (UHS) of zirconia: A master sintering curve analysis
Biesuz, Mattia;
2021-01-01
Abstract
A thermally-insulated Ultra-fast High temperature Sintering (UHS) has been developed to maximize the densification of 3 mol% yttria-stabilized zirconia and improve the energy efficiency of the process. Thermally-Insulated UHS (TI-UHS) employed a fibreboard insulator, which reduced the energy consumption by ≈40% compared to the reference set-up. An ultrafast heating rate, approaching ≈2000°C/min, produced dense (99% relative density) and fine-grained (178±18 nm) microstructures within 60 s. By cross-linking finite element simulations with master sintering curves a good fit between experimental and predicted density was obtained, allowing the development of predictive models for UHS densification. © 2021 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.File | Dimensione | Formato | |
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Dong et al SM2021 TI UHS.pdf
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