Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about 1×1016 neq cm-2 (1 MeV equivalent neutrons). All presented results are part of the CMS R&D activities in view of the pixel detector upgrade for the High Luminosity phase of the LHC at CERN (HL-LHC) . A preliminary analysis of the collected data shows hit detection efficiencies around 97% measured after proton irradiation.

First results on 3D pixel sensors interconnected to the RD53A readout chip after irradiation to 1×1016 neq cm / Meschini, M.; Ceccarelli, R.; Dinardo, M.; Gennai, S.; Moroni, L.; Zuolo, D.; Demaria, L.; Monteil, E.; Gaioni, L.; Messineo, A.; Curras, E.; Duarte, J.; Fernandez, M.; Gomez, G.; Garcia, A.; Gonzalez, J.; Silva, E.; Vila, I.; Dalla Betta, G. F.; Mendicino, R.; Boscardin, M.. - In: JOURNAL OF INSTRUMENTATION. - ISSN 1748-0221. - ELETTRONICO. - 14:6(2019), pp. C06018-C06018. [10.1088/1748-0221/14/06/C06018]

First results on 3D pixel sensors interconnected to the RD53A readout chip after irradiation to 1×1016 neq cm

Dalla Betta G. F.;Mendicino R.;Boscardin M.
2019-01-01

Abstract

Results obtained with 3D columnar pixel sensors bump-bonded to the RD53A prototype readout chip are reported. The interconnected modules have been tested in a hadron beam before and after irradiation to a fluence of about 1×1016 neq cm-2 (1 MeV equivalent neutrons). All presented results are part of the CMS R&D activities in view of the pixel detector upgrade for the High Luminosity phase of the LHC at CERN (HL-LHC) . A preliminary analysis of the collected data shows hit detection efficiencies around 97% measured after proton irradiation.
2019
6
Meschini, M.; Ceccarelli, R.; Dinardo, M.; Gennai, S.; Moroni, L.; Zuolo, D.; Demaria, L.; Monteil, E.; Gaioni, L.; Messineo, A.; Curras, E.; Duarte, ...espandi
First results on 3D pixel sensors interconnected to the RD53A readout chip after irradiation to 1×1016 neq cm / Meschini, M.; Ceccarelli, R.; Dinardo, M.; Gennai, S.; Moroni, L.; Zuolo, D.; Demaria, L.; Monteil, E.; Gaioni, L.; Messineo, A.; Curras, E.; Duarte, J.; Fernandez, M.; Gomez, G.; Garcia, A.; Gonzalez, J.; Silva, E.; Vila, I.; Dalla Betta, G. F.; Mendicino, R.; Boscardin, M.. - In: JOURNAL OF INSTRUMENTATION. - ISSN 1748-0221. - ELETTRONICO. - 14:6(2019), pp. C06018-C06018. [10.1088/1748-0221/14/06/C06018]
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11572/258059
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