This paper aims to present the design and the achieved results on a CMOS electronic and photonic integrated device for low cost, low power, transparent, mass-manufacturable optical switching. An unprecedented number of integrated photonic components (more than 1000), each individually electronically controlled, allows for the realization of a transponder aggregator device which interconnects up to eight transponders to a four direction colorless-directionless-contentionless ROADM. Each direction supports 12 200-GHz spaced wavelengths, which can be independently added or dropped from the network. An electronic ASIC, 3-D integrated on top of the photonic chip, controls the switch fabrics to allow a complete and microsecond fast reconfigurability
Design and Implementation of an Integrated Reconfigurable Silicon Photonics Switch Matrix in IRIS Project / Testa, F., Oton, C.J., Kopp, C., Lee, J.M., Ortuño, R., Enne, R., Tondini, S., Chiaretti, G., Bianchi, A., Pintus, P., Kim, M.S., Fowler, D., Ayúcar, J.Á., Hofbauer, M., Mancinelli, M., Fournier, M., Preve, G.B., Zecevic, N., Manganelli, C.L., Castellan, C., et al.. - In: IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS. - ISSN 1077-260X. - STAMPA. - 22:6(2016), pp. 1-14. [10.1109/JSTQE.2016.2547322]
Design and Implementation of an Integrated Reconfigurable Silicon Photonics Switch Matrix in IRIS Project
Tondini, Stefano;Mancinelli, Mattia;Castellan, Claudio;Pavesi, Lorenzo;
2016-01-01
Abstract
This paper aims to present the design and the achieved results on a CMOS electronic and photonic integrated device for low cost, low power, transparent, mass-manufacturable optical switching. An unprecedented number of integrated photonic components (more than 1000), each individually electronically controlled, allows for the realization of a transponder aggregator device which interconnects up to eight transponders to a four direction colorless-directionless-contentionless ROADM. Each direction supports 12 200-GHz spaced wavelengths, which can be independently added or dropped from the network. An electronic ASIC, 3-D integrated on top of the photonic chip, controls the switch fabrics to allow a complete and microsecond fast reconfigurability| File | Dimensione | Formato | |
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