A new software was developed for the X-ray stress analysis of textured materials, especially useful in the case of thin films and coating. Literature data for a sputtered Cu thin film were used as a test case. Good agreement with the published results was found considering a grain interaction mechanism based on the combination of four models (Ruess/Voigt/Vook-Witt/inverse Vook-Witt). A similar value for the in-plane residual stress was obtained by the Eshelby-Kröner model, by optimizing the grain aspect-ratio. Main features and numerical/graphic output are briefly discussed.
Analysis of Residual Stress-Texture Relationships in Thin Films / Ortolani, Matteo; Azanza Ricardo, Cristy Leonor; Scardi, Paolo. - STAMPA. - 89-91(2010), pp. 425-430. ((Intervento presentato al convegno THERMEC 2009 tenutosi a Berlin nel August 25-29, 2009 [10.4028/www.scientific.net/AMR.89-91.425].
Titolo: | Analysis of Residual Stress-Texture Relationships in Thin Films | |
Autori: | Ortolani, Matteo; Azanza Ricardo, Cristy Leonor; Scardi, Paolo | |
Autori Unitn: | ||
Titolo del volume contenente il saggio: | THERMEC 2009 Supplement | |
Luogo di edizione: | [Stäfa] | |
Casa editrice: | Trans Tech Publications Ltd | |
Anno di pubblicazione: | 2010 | |
Codice identificativo Scopus: | 2-s2.0-75749118562 | |
Codice identificativo WOS: | WOS:000307888500073 | |
ISBN: | 9780878492947 | |
Handle: | http://hdl.handle.net/11572/92905 | |
Citazione: | Analysis of Residual Stress-Texture Relationships in Thin Films / Ortolani, Matteo; Azanza Ricardo, Cristy Leonor; Scardi, Paolo. - STAMPA. - 89-91(2010), pp. 425-430. ((Intervento presentato al convegno THERMEC 2009 tenutosi a Berlin nel August 25-29, 2009 [10.4028/www.scientific.net/AMR.89-91.425]. | |
Appare nelle tipologie: | 04.1 Saggio in atti di convegno (Paper in proceedings) |
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