Analysis of Residual Stress-Texture Relationships in Thin Films

Ortolani, Matteo; Azanza Ricardo, Cristy Leonor; Scardi, Paolo

doi:10.4028/www.scientific.net/AMR.89-91.425

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A new software was developed for the X-ray stress analysis of textured materials, especially useful in the case of thin films and coating. Literature data for a sputtered Cu thin film were used as a test case. Good agreement with the published results was found considering a grain interaction mechanism based on the combination of four models (Ruess/Voigt/Vook-Witt/inverse Vook-Witt). A similar value for the in-plane residual stress was obtained by the Eshelby-Kröner model, by optimizing the grain aspect-ratio. Main features and numerical/graphic output are briefly discussed.

Titolo:	Analysis of Residual Stress-Texture Relationships in Thin Films
Autori Unitn:	Ortolani, Matteo Azanza Ricardo, Cristy Leonor Scardi, Paolo
Anno di pubblicazione:	2010
Titolo del periodico:	ADVANCED MATERIALS RESEARCH
Citazione:	Analysis of Residual Stress-Texture Relationships in Thin Films / M. Ortolani; C. L. Azanza Ricardo; P. Scardi. - In: ADVANCED MATERIALS RESEARCH. - ISSN 1662-8985. - STAMPA. - 89-91(2010), pp. 425-430.
Abstract:	A new software was developed for the X-ray stress analysis of textured materials, especially useful in the case of thin films and coating. Literature data for a sputtered Cu thin film were used as a test case. Good agreement with the published results was found considering a grain interaction mechanism based on the combination of four models (Ruess/Voigt/Vook-Witt/inverse Vook-Witt). A similar value for the in-plane residual stress was obtained by the Eshelby-Kröner model, by optimizing the grain aspect-ratio. Main features and numerical/graphic output are briefly discussed.
Handle:	http://hdl.handle.net/11572/92905
Appare nelle tipologie:	03.1 Articolo su rivista (Journal article)

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