.This work reports on RF MEMS chip capping to protect sensitive devices by quartz caps having a cavity to enclose MEMS devices and an epoxy dry film polymer as a sealing ring. The fabrication process for both cap-to-die and wafer-to-wafer 0-level capping is presented. Good adhesion of caps to the substrate is demonstrated by shear tests, while RF measurements on CPW lines indicate a negligible insertion loss increase. Capping of both capacitive and ohmic switches is reported indicating no loss of functionality but a modification of actuation voltage induced by the thermal treatment.

RF-MEMS chip capping by dry film epoxy polymer

Sordo, Guido;
2012-01-01

Abstract

.This work reports on RF MEMS chip capping to protect sensitive devices by quartz caps having a cavity to enclose MEMS devices and an epoxy dry film polymer as a sealing ring. The fabrication process for both cap-to-die and wafer-to-wafer 0-level capping is presented. Good adhesion of caps to the substrate is demonstrated by shear tests, while RF measurements on CPW lines indicate a negligible insertion loss increase. Capping of both capacitive and ohmic switches is reported indicating no loss of functionality but a modification of actuation voltage induced by the thermal treatment.
2012
MEMSWAVE 2012.
Antalya, Turkey
Memswave
F., Giacomozzi; S., Colpo; A., Faes; Sordo, Guido; S., Girardi; P., Farinelli
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11572/33711
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