Micro-Hole Drilling (μHD) and Micro-Slot Cutting (μSC) methods for the measurement of residual stress at the micron scale have recently been proposed but have yet to be evaluated and validated against other methods such as X-ray Diffraction (XRD). In this paper near surface and sub-surface residual stresses were measured in ceramic-shot peened and fatigued Al-7075-T651 double notched samples using μHD and μSC methods, and compared to XRD micro-diffractometer results and Finite-Element (FE) predictions. The micron-seized sampling volumes enabled the stress to be evaluated in individual impact craters (dimples) showing significant point-to-point variation (~±150 MPa) (with certain dimples even recording tensile stresses). At a depth of around 30 μm the heavily deformed region had largely been removed and the stress became much more homogeneous. At this depth the μHD and μSC results were in good accord with those from XRD and FE modelling showing a stress of around 150 MPa far from the notch with stress increasing at the notch being to about 200 MPa for the blunt (2 mm) notch and 500 MPa for the sharp (0.15 mm).

Comparative analysis of shot-peened residual stresses using micro-hole drilling, micro-slot cutting, X-ray diffraction methods and finite-element modelling / Winiarski, B.; Benedetti, M.; Fontanari, V.; Allahkarami, M.; Hanan, J. C.; Schajer, G. S.; Withers, P. J.. - ELETTRONICO. - 9:(2016), pp. 215-223. (Intervento presentato al convegno SEM Annual Conference and Exposition on Experimental and Applied Mechanics, 2015 tenutosi a usa nel 2015) [10.1007/978-3-319-21765-9_27].

Comparative analysis of shot-peened residual stresses using micro-hole drilling, micro-slot cutting, X-ray diffraction methods and finite-element modelling

Benedetti, M.;Fontanari, V.;
2016-01-01

Abstract

Micro-Hole Drilling (μHD) and Micro-Slot Cutting (μSC) methods for the measurement of residual stress at the micron scale have recently been proposed but have yet to be evaluated and validated against other methods such as X-ray Diffraction (XRD). In this paper near surface and sub-surface residual stresses were measured in ceramic-shot peened and fatigued Al-7075-T651 double notched samples using μHD and μSC methods, and compared to XRD micro-diffractometer results and Finite-Element (FE) predictions. The micron-seized sampling volumes enabled the stress to be evaluated in individual impact craters (dimples) showing significant point-to-point variation (~±150 MPa) (with certain dimples even recording tensile stresses). At a depth of around 30 μm the heavily deformed region had largely been removed and the stress became much more homogeneous. At this depth the μHD and μSC results were in good accord with those from XRD and FE modelling showing a stress of around 150 MPa far from the notch with stress increasing at the notch being to about 200 MPa for the blunt (2 mm) notch and 500 MPa for the sharp (0.15 mm).
2016
Conference Proceedings of the Society for Experimental Mechanics Series
New York
Springer New York LLC
9783319217642
Winiarski, B.; Benedetti, M.; Fontanari, V.; Allahkarami, M.; Hanan, J. C.; Schajer, G. S.; Withers, P. J.
Comparative analysis of shot-peened residual stresses using micro-hole drilling, micro-slot cutting, X-ray diffraction methods and finite-element modelling / Winiarski, B.; Benedetti, M.; Fontanari, V.; Allahkarami, M.; Hanan, J. C.; Schajer, G. S.; Withers, P. J.. - ELETTRONICO. - 9:(2016), pp. 215-223. (Intervento presentato al convegno SEM Annual Conference and Exposition on Experimental and Applied Mechanics, 2015 tenutosi a usa nel 2015) [10.1007/978-3-319-21765-9_27].
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11572/230652
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