IRIS
Mendicino, Roberto
 Distribuzione geografica
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Continente #
EU - Europa 110
NA - Nord America 89
AS - Asia 14
AF - Africa 2
Totale 215
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Nazione #
US - Stati Uniti d'America 89
IT - Italia 79
FR - Francia 17
VN - Vietnam 6
DE - Germania 3
RU - Federazione Russa 3
DZ - Algeria 2
FI - Finlandia 2
HK - Hong Kong 2
SG - Singapore 2
UA - Ucraina 2
BE - Belgio 1
CN - Cina 1
HU - Ungheria 1
JP - Giappone 1
LU - Lussemburgo 1
NL - Olanda 1
SA - Arabia Saudita 1
TR - Turchia 1
Totale 215
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Città #
Trento 47
Buffalo 9
Fairfield 9
Seattle 8
Ashburn 6
Santa Cruz 6
Dallas 5
Dong Ket 5
Udine 4
Boardman 3
Cambridge 3
San Diego 3
Trieste 3
Central 2
Council Bluffs 2
Helsinki 2
Houston 2
Malo 2
Rosolina 2
Wilmington 2
Aliso Viejo 1
Ann Arbor 1
Atlanta 1
Belluno 1
Boara Pisani 1
Budapest 1
Cedar Knolls 1
Chicago 1
Clearwater 1
Como 1
Crugers 1
Des Moines 1
Florence 1
Hangzhou 1
Las Vegas 1
Leuven 1
Los Angeles 1
Luxembourg 1
Martano 1
Milan 1
Moscow 1
New Haven 1
Parma 1
Perugia 1
Phoenix 1
Reston 1
Sarezzo 1
St Petersburg 1
Tampa 1
Woodbridge 1
Yellow Springs 1
Yoshizuka 1
Totale 157
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Nome #
Semiconductor neutron detectors, file e3835192-fcba-72ef-e053-3705fe0ad821 69
Comparing different bulk radiation damage models in TCAD simulations of small-pitch 3D Si sensors, file a3272564-9bc2-45d5-9ef1-b13cf6eca446 31
Intrinsic time resolution of 3D-trench silicon pixels for charged particle detection, file e3835197-b34c-72ef-e053-3705fe0ad821 27
PixFEL project: hybrid High Dynamic Range X-ray image sensor for application at future FEL facilities, file e3835192-fdeb-72ef-e053-3705fe0ad821 15
A CMOS-MEMS Pixel Sensor for Thermal Neutron Imaging, file 3652ece2-f044-427a-9a52-6d2cf6e5eed3 12
Advances in 3D Sensor Technology by Using Stepper Lithography, file e3835199-1ea0-72ef-e053-3705fe0ad821 12
Novel 3D Pixel Sensors for the Upgrade of the ATLAS Inner Tracker, file e3835199-1e9c-72ef-e053-3705fe0ad821 7
Characterization of SINTEF 3D diodes with trenched-electrode geometry before and after neutron irradiation, file e3835197-b128-72ef-e053-3705fe0ad821 4
Characterization of FBK small-pitch 3D diodes after neutron irradiation up to 3.5 × 10 16 n eq cm -2, file e3835195-e232-72ef-e053-3705fe0ad821 3
3D trenched-electrode pixel sensors: Design, technology and initial results, file e3835197-73df-72ef-e053-3705fe0ad821 3
Test beam characterization of irradiated 3D pixel sensors, file e3835197-b7ff-72ef-e053-3705fe0ad821 3
The PixFEL project: development of advanced X-ray pixel detectors for application at future FEL facilities, file e3835192-fcc9-72ef-e053-3705fe0ad821 2
Micromachined Silicon Radiation Sensors – Part 1: Design And Experimental Characterization, file e3835192-fde7-72ef-e053-3705fe0ad821 2
Integrated Source Follower for the Read-Out of Silicon Sensor Arrays, file e3835192-feca-72ef-e053-3705fe0ad821 2
Development of 3D trenched-electrode pixel sensors with improved timing performance, file e3835196-5fb6-72ef-e053-3705fe0ad821 2
First results on 3D pixel sensors interconnected to the RD53A readout chip after irradiation to 1×1016 neq cm, file e3835196-8dd6-72ef-e053-3705fe0ad821 2
First results of the TIMESPOT project on developments on fast sensors for future vertex detectors, file e3835197-73e1-72ef-e053-3705fe0ad821 2
Comparing different bulk radiation damage models in TCAD simulations of small-pitch 3D Si sensors, file e3835199-4544-72ef-e053-3705fe0ad821 2
Development and characterization of a novel alpha particle SOI pixel sensor for neutron detection, file d241801d-a277-4165-aff7-466fe86498ff 1
Micromachined Silicon Radiation Sensors – Part 2: Fabrication Technologies, file e3835192-fcb6-72ef-e053-3705fe0ad821 1
Development of a new generation of 3D pixel sensors for HL-LHC, file e3835192-fcc2-72ef-e053-3705fe0ad821 1
In-pixel conversion with a 10 bit SAR ADC for next generation X-ray FELs, file e3835192-fcc5-72ef-e053-3705fe0ad821 1
3D silicon sensors with variable electrode depth for radiation hard high resolution particle tracking, file e3835192-fccd-72ef-e053-3705fe0ad821 1
The INFN-FBK "phase-2" R&D program, file e3835192-fe54-72ef-e053-3705fe0ad821 1
Characterization of the first double-sided 3D radiation sensors fabricated at FBK on 6-inch silicon wafers, file e3835192-fe57-72ef-e053-3705fe0ad821 1
PixFEL: developing a fine pitch, fast 2D X-ray imager for the next generation X-FELs, file e3835192-fe64-72ef-e053-3705fe0ad821 1
Characterization of 3D and planar Si diodes with different neutron converter materials, file e3835192-fe67-72ef-e053-3705fe0ad821 1
A 10 bit resolution readout channel with dynamic range compression for X-ray imaging at FELs, file e3835193-a215-72ef-e053-3705fe0ad821 1
Results on proton-irradiated 3D pixel sensors interconnected to RD53A readout ASIC, file e3835196-5fb4-72ef-e053-3705fe0ad821 1
3D trenched-electrode sensors for charged particle tracking and timing, file e3835196-5fb8-72ef-e053-3705fe0ad821 1
Simulation of 3D-Silicon sensors for the TIMESPOT project, file e3835196-7c66-72ef-e053-3705fe0ad821 1
Radiation resistant innovative 3D pixel sensors for the CMS upgrade at the High Luminosity LHC, file e3835197-73dd-72ef-e053-3705fe0ad821 1
Performance of new radiation-tolerant thin planar and 3D columnar n+ on p silicon pixel sensors up to a maximum fluence of ∼5×1015neq/cm2, file e3835197-ac0d-72ef-e053-3705fe0ad821 1
Timing optimization for 3D silicon sensors, file e3835197-b7fb-72ef-e053-3705fe0ad821 1
Development of 3D Silicon radiation detectors for neutrons and high energy charged particles, file f7c43be1-c105-4919-a39b-676a66d31c3c 1
Totale 217
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Categoria #
all - tutte 1.665
article - articoli 0
book - libri 0
conference - conferenze 0
curatela - curatele 0
other - altro 0
patent - brevetti 0
selected - selezionate 0
volume - volumi 0
Totale 1.665
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Totale Lug Ago Sett Ott Nov Dic Gen Feb Mar Apr Mag Giu
2019/202037 0 0 2 9 5 3 2 4 3 1 7 1
2020/202120 0 2 0 2 0 2 1 3 2 1 1 6
2021/202245 3 2 0 0 2 0 1 1 0 22 11 3
2022/202355 2 3 6 2 9 6 2 3 9 3 9 1
2023/202450 2 5 5 2 4 14 8 1 6 3 0 0
Totale 217