<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/CINECAstyle.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-21T12:12:52Z</responseDate><request verb="GetRecord" identifier="oai:iris.unitn.it:11572/367699" metadataPrefix="oai_dc">https://iris.unitn.it/oai/request</request><GetRecord><record><header><identifier>oai:iris.unitn.it:11572/367699</identifier><datestamp>2026-04-03T00:46:27Z</datestamp><setSpec>com_11572_237821</setSpec><setSpec>com_11572_101871</setSpec><setSpec>col_11572_237822</setSpec><setSpec>ou_ou00006</setSpec></header><metadata><oai_dc:dc xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/" xmlns:doc="http://www.lyncode.com/xoai" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:dc="http://purl.org/dc/elements/1.1/" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/oai_dc/ http://www.openarchives.org/OAI/2.0/oai_dc.xsd">
<dc:title>Development of Small-Pitch, Thin 3D Sensors for Pixel Detector Upgrades at HL-LHC</dc:title>
<dc:creator>Sultan, D M S</dc:creator>
<dc:contributor>Sultan, D M S</dc:contributor>
<dc:contributor>Dalla Betta, Gian Franco</dc:contributor>
<dc:subject>Settore ING-IND/20 - Misure e Strumentazione Nucleari</dc:subject>
<dc:subject>Settore ING-INF/07 - Misure Elettriche e Elettroniche</dc:subject>
<dc:subject>Settore ING-INF/01 - Elettronica</dc:subject>
<dc:subject>Settore FIS/01 - Fisica Sperimentale</dc:subject>
<dc:description>3D Si radiation sensors came along with extreme radiation hard properties, primarily owing to the geometrical advantages over planar sensors where electrodes are formed penetrating through the active substrate volume. Among them: reduction of the inter-electrode distance, lower depletion voltage requirement, inter-columnar high electric field distribution, lower trapping probability, faster charge collection capability, lower power dissipation, and lower inter-pitch charge sharing. Since several years, FBK has developed 3D sensors with a double-sided technology, that have also been installed in the ATLAS Insertable B-Layer at LHC. However, the future High-Luminosity LHC (HL-LHC) upgrades, aimed to be operational by 2024, impose a complete swap of current 3D detectors with more radiation hard sensor design, able to withstand very large particle fluences up to 2×1016 cm-2 1-MeV equivalent neutrons. The extreme luminosity conditions and related issues in occupancy and radiation hardness lead to very dense pixel granularity (50×50 or 25×100 μm2), thinner active region (~100 μm), narrower columnar electrodes (~5μm diameter) with reduced inter-electrode spacing (~30 μm), and very slim edges (~100 μm) into the 3D pixel sensor design. This thesis includes the development of this new generation of small-pitch and thin 3D radiation sensors aimed at the foreseen Inner Tracker (ITk) upgrades at HL-LHC.</dc:description>
<dc:date>2017</dc:date>
<dc:type>info:eu-repo/semantics/doctoralThesis</dc:type>
<dc:identifier>https://hdl.handle.net/11572/367699</dc:identifier>
<dc:identifier>http://dx.doi.org/10.15168/11572_367699</dc:identifier>
<dc:identifier>10.15168/11572_367699</dc:identifier>
<dc:language>eng</dc:language>
<dc:relation>firstpage:1</dc:relation>
<dc:relation>lastpage:184</dc:relation>
<dc:relation>numberofpages:184</dc:relation>
<dc:rights>info:eu-repo/semantics/openAccess</dc:rights>
<dc:publisher>Università degli studi di Trento</dc:publisher>
<dc:publisher>place:TRENTO</dc:publisher>
<dc:rights>license:Tutti i diritti riservati (All rights reserved)</dc:rights>
<dc:rights>license:Tutti i diritti riservati (All rights reserved)</dc:rights>
<dc:rights>license uri:iris.PRI01</dc:rights>
</oai_dc:dc></metadata></record></GetRecord></OAI-PMH>