A new software was developed for the X-ray stress analysis of textured materials, especially useful in the case of thin films and coating. Literature data for a sputtered Cu thin film were used as a test case. Good agreement with the published results was found considering a grain interaction mechanism based on the combination of four models (Ruess/Voigt/Vook-Witt/inverse Vook-Witt). A similar value for the in-plane residual stress was obtained by the Eshelby-Kröner model, by optimizing the grain aspect-ratio. Main features and numerical/graphic output are briefly discussed.
Analysis of Residual Stress-Texture Relationships in Thin Films / Ortolani, Matteo; Azanza Ricardo, Cristy Leonor; Scardi, Paolo. - STAMPA. - 89-91:(2010), pp. 425-430. (Intervento presentato al convegno THERMEC 2009 tenutosi a Berlin nel August 25-29, 2009) [10.4028/www.scientific.net/AMR.89-91.425].
Analysis of Residual Stress-Texture Relationships in Thin Films
Ortolani, Matteo;Azanza Ricardo, Cristy Leonor;Scardi, Paolo
2010-01-01
Abstract
A new software was developed for the X-ray stress analysis of textured materials, especially useful in the case of thin films and coating. Literature data for a sputtered Cu thin film were used as a test case. Good agreement with the published results was found considering a grain interaction mechanism based on the combination of four models (Ruess/Voigt/Vook-Witt/inverse Vook-Witt). A similar value for the in-plane residual stress was obtained by the Eshelby-Kröner model, by optimizing the grain aspect-ratio. Main features and numerical/graphic output are briefly discussed.| File | Dimensione | Formato | |
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